Seeking 3+ years experience developing and improving precision micro-assembly processes involving precision flip chip bonding and solid knowledge of semiconductor package constructions, processes, properties and materials.

Technologies:

*** Ball Grid Array

*** No Lead Quad Flat Packaging

*** Wafer Level Chip Scale Packaging

*** Flip Chip Bonding

Shall:

*** Oversee and coordinate highly complex manufacturing involving robotic bonding, soldering, and packaging.

*** Drive lean manufacturing methods throughout operation.

*** Participate in product design especially manufacturability issues.

*** Train staff in setup, maintenance, programming and operation of equipment.

*** Develop documentation and SOP's.

Multinational corporation supplying major companies around the world offering this highly visible role as a key contributor to the overall success and growth of the company. Generous employment packages include, but are not limited to: Salary $85,000 to $110,000 plus bonus plan; company paid full family coverage medical, dental, prescription and vision; matched 401(k); and stock options.

For complete details contact James A. Lockley, LT USN (Ret) at:
(609) 584-9000 ext 278

Or submit resume online at:
http://dmc9.com/jal/app.asp

Or email to:
1000011457_10007183@cand693seek.com

Please reference #34279 when responding.
 
Education Requirements: Bachelor Degree
Minimum Experience Requirements: 2-5 years
Job City Location: Florham Park
Job State Location: NJ
Job Country Location: USA
Salary Range: $85,000 to $110,000

WE ARE AN EQUAL OPPORTUNITY EMPLOYER and our employment decisions are made without regard to race, color, religion, age, sex, national origin, handicap, disability or marital status. We reasonably accommodate individuals with handicaps, disabilities and bona fide religious beliefs. Jobs Career Position Hiring. CONSIDERED EXPERIENCE INCLUDES: Http://najobbank.com Www.najobbank.com Top 10 Job Site Top 10 Careers Site Finetech Atco ASM Pacific Flip Chips Chip Reflow Ovens Assembly MEMS Devices Flip Chip Bonders Vacuum Tools Solder Reflow Passive Alignment Active Alignment Annealing Bi-directional Microscopes Vision & Process Control Technology BGA’s CSP’s QFN’s Flip Chips PoP micro Dies SMD’s Ball Grid Array No Lead Quad Flat Packaging WLCSP Wafer Level Chip Scale Packaging Semiconductor Packaging Engineer Engineer Flip Chip Bonding Semiconductor Package Engineering BS B.S. Bachelors

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